WS-820 Solder Paste

ALPHA WS-820 WATER SOLUBLE, LEAD-FREE SOLDER PASTE DESCRIPTION ALPHA WS-820 a lead free, halide free solder paste offering the ideal combination of printability and reflow profile process window, with excellent cleanability in a lead free alloy solder paste. FEATURES & BENEFITS ? Excellent print volume and print volume repeatability down to 12 mil (0.3mm) features ? Able to spread and wet using straight ramp or soak reflow profiles in air ? High spread/wetting lead free paste compatible with lead free alloys and surface finishes ? High Reflow Yield with IPC Class II Voiding Performance when used to solder BGA components ? Excellent wetting characteristics on all common surface finishes (including Entek HT OSP). JIS Spread 88.6% on Entek HT OSP ? Cleanable with water based cleaning systems PRODUCT INFORMATION ? Alloys: SAC305, SAC405, SACX Plus 0807, 96.5Sn3.5Ag, 95.5Sn3.8Ag0.7Cu, 95.5Sn4Ag0.5Cu & Innolot ? Application: Stencil printing (87.6% Metal Loading, M19 Viscosity) Dispense application (84.8% Metal Loading, Type 3 Powder, M7 Viscosity) ? Powder Size: Type 3 & Type 4 ? RoHS Status: Completely free of Hazardous Materials per RoHS Directive 2002/95/EC Solder Paste ALPHA WS-820 is the newest Alpha brand lead free, halide free, solder paste, offering the ideal combination of printability and reflow profile process window with excellent cleanability in a lead free alloy solder paste. ALPHA WS-820 was formulated to meet the requirements of water soluble solder lead free applications, and it was developed to increase the reflow profile window of WS-819, while offering exceptional post reflow cleanability and low BGA voiding. This paste is designed to enable users of ALPHA WS-609, WS-709 and WS-809 and other leading water soluble paste brands to comply with RoHS and customer based demand for lead free materials. Features & Benefits Excellent print volume and print volume repeatability down to 12 mil (0.3mm) features Able to spread and wet using straight ramp or soak reflow profiles in air High spread/wetting lead free paste compatible with lead free alloys and surface finishes High Reflow Yield with IPC Class II Voiding Performance when used to solder BGA components Excellent wetting characteristics on all common surface finishes (including Entek HT OSP). JIS Spread 88.6% on Entek HT OSP. Cleanable with water based cleaning systems