WS-809 Solder Paste

ALPHA WS-809 WATER SOLUBLE SOLDER PASTE DESCRIPTION ALPHA WS-809 is a SnPb, water-soluble solder paste which is designed for a broad range of SMT processes where aqueous post reflow cleaning is required. FEATURES & BENEFITS Excellent volume transfer efficiency over broad range of environmental conditions Fine-pitch printing with consistent shape and volume to 16 mil pitch QFP (63x10x5 mil deposits) and 15 mil circles (BGA225) High throughput and yield with consistent print volumes at print speeds ranging from 1 6 inches/second Exhibits resistance to slumping and drying at temperature up to 66 84F (19- 29C) and relative humidity extremes (35%-65% RH) Water cleanable after two paste reflow cycles Excellent low voiding performance that exceeds IPC Class III requirement Superior solder spread performance on Cu OSP PRODUCT INFORMATION Alloys: 63Sn/37Pb, 62Sn/36Pb/2Ag, NT4S Powder Size: 89.8% Metal, Type 3 (25-45 m) / Type 4 (20-38 m) per IPC J-STD-005) Packaging Sizes: 500 gram jars, 6 and 12 cartridges Flux Gel: Available in 10cc and 30cc syringes for rework applications ALPHA WS-809 is a SnPb, water-soluble which is designed for a broad range of SMT processes where aqueous post reflow cleaning is required. ALPHA WS-809 is formulated for both standard and fine feature pitch stencil printing, at print speeds between 1/sec (25 mm/sec) and 6/sec (150 mm/sec) with stencil thicknesses of 5 mil (0.125 mm) to 6 mil (0.15 mm), particularly when used in conjunction with ALPHA Stencils. Blade pressures should be between 1 2 lbs/in (0.16 0.34 kg/cm), depending on the print speed. The higher the print speed employed, the higher the blade pressure that is required. Features & Benefits Excellent volume transfer efficiency over broad range of environmental conditions Fine-pitch printing with consistent shape and volume to 16 mil pitch QFP (63x10x5 mil deposits) and 15 mil circles (BGA225) High throughput and yield with consistent print volumes at print speeds ranging from 16 inches/second Exhibits resistance to slumping and drying at temperature up to 6684F (19-29C) and relative humidity extremes (35%-65% RH) Water cleanable after two paste reflow cycles Excellent low voiding performance that exceeds IPC Class III requirement Superior solder spread performance on Cu OSP