OM-5100 Solder Paste

ALPHA OM-5100 FINE PITCH SOLDER PASTE DESCRIPTION ALPHA OM-5100, is a low residue, no-clean solder paste designed to maximize SMT line yields. The flux vehicle is rheologically formulated to provide excellent repeatability and resistance to environmental conditions. The ALPHA OM-5100 activation system has been optimized to enhance joint solderability, limit soldering defects and maintaining long term reliability. Minimizing defects requires robust and repeatable processes, equipment and materials. ALPHA OM-5100s wide reflow profile window enables soldering of lead free components with this tin lead paste. Tests show that complex assemblies with small (0201) tin finished passives and large (1mm pitch) BGA components with SAC 305 spheres can be assembled. Small print deposits remain fully coalesced, even in profiles hot enough to collapse SAC 305 BGA spheres. FEATURES & BENEFITS ? Quick start up and simple product substitution from current material ? Print Consistency: Lower deposit to deposit variation drives maximization of first pass print and reflow yields ? Print Repeatability: Lower variability after production dwells, ensuring a continuous production flow with minimized level of insufficient solder joints ? Solder Ball Reduction: Minimizing both mid chip and random solder balls helps to maximize reflow yields ? Excellent Solder Spread: Compatibility with a variety of pad and lead finishes drives overall cosmetics and yields up! ? Response to pause performance, generating less defects due to start up ? High print speed, up to 150 mm/sec (6 inch/sec) ? Efficient activation system providing defect free soldering with a wide range of oven profiles ? Low residue level with minimal spread for reliable underfilling processes and results ? Excellent reliability properties, halide-free material ? Enables assembly of Pb free components with tin lead solder paste PRODUCT INFORMATION Alloys: 62Sn/36Pb/2Ag, 63Sn/37Pb and 62.8Sn/36.8Pb/0.4Ag (NT4S, Anti Tombstoning Alloy) Powder Size: Type 3, (25-45 ?m per IPC J-STD-005) or Type 4 (20-38m). Packaging Sizes: 500 gram jars, 6 and 12cartridges, and DEK ProFlowTM cassettes. Flux Gel: Available in 10cc and 30cc syringes for rework applications.