ALPHA Vaculoy SAC305, Solder Alloy

ALPHA Vaculoy SAC300,305,350,400,405 Lead Free Wave Solder Alloy DESCRIPTION Sn96.5Ag3Cu0.5 and Sn95.5Ag4Cu0.5 and their replenishment alloys Sn97Ag3Cu0, Sn96.5Ag3.5Cu0 and Sn96Ag4Cu0 are lead-free alloys suitable for use as a replacement for Sn63 alloy. The replenishment alloys are sometimes used to stabilize / reduce the copper content in the wave solder bath, this requirement will depend on process conditions. As with all Alpha Assembly Solutions bar solder, Alphas proprietary Vaculoy alloying process is used to remove certain impurities, particularly oxides. FEATURES & BENEFITS Features Yield Best in class yield, out performs all Sn/Cu based materials Wetting speed fast wetting, in back to back tests 0.65s compared to 1.00s, for Sn/Cu based materials Dross generation Low dross generation delivered by Vaculoy alloy conditioning Benefits Excellent solderability due to fast wetting speed Very good drainage, has lower levels of bridging compared to Sn/Cu alloys Delivers excellent performance across a wide range of Flux technologies The proprietary Vaculoy process is a highly effective method for removing included oxides from solder. This is extremely important because included oxides generate excessive drossing and increase the viscosity of the solder. Solder with higher viscosity can result in increased soldering defects (i.e solder bridging) APPLICATION Sn96.5Ag3.0Cu0.5 and Sn95.5Ag4Cu0.5 are suitable for wave soldering and surface mount applications for electronic assemblers interested in implementing a lead-free process. A solder pot temperature of 255 - 265C (491-509F) is recommended. For suitable wave solder fluxes, please see our selector guide. Lead free Reclaim services including dedicated lead free containers are also available. Please consult your local sales office.