ALPHA Telecore PLUS

ALPHA TELECORE PLUS NO-CLEAN, CORED SOLDER WIRE DESCRIPTION ALPHA TELECORE PLUS is a low residue core solder designed for no-clean soldering applications that meet high SIR reliability and excellent spread characteristics. The unique blend of rosin and proprietary activators provide rapid wetting while leaving minimal, optically clear, completely inert residue. FEATURES & BENEFITS Fast wetting ? Excellent for High Throughput. Good spread characteristics ? Excellent Solder Joints Formation. Clear non-tacky residue ? No-Clean Residues. Useful for all Applications. Provides good joint appearance ? Makes Inspection easy. PRODUCT INFORMATION Standard Alloy Designation Melting or Solidus / Liquidus Temp C Flux Amount Proprietary SACX Plus 0307 217 - 228 2.2% & 3.3% Proprietary SACX Plus 0807 217 - 226 2.2% & 3.3% J-STD-006C Sn96.5Ag3.0Cu0.5 (SAC305) 217 - 221 2.2%, 3.3% J-STD-006C Sn96.5Ag3.5 221 2.2%, 3.3% J-STD-006C Sn99.3Cu0.7 227 2.2%, 3.3% J-STD-006C Sn63Pb37 183 1.1%, 2.2% J-STD-006C Sn62Pb36Ag2 179 1.1%, 2.2% J-STD-006C Sn10Pb88Ag2 268 - 299 1.1%, 2.2% * TELECORE PLUS may also be available in other or special alloys and flux amounts on request.