Soder-Wick No Clean

Soder-Wick No Clean (#3 green\, 0.080"/2.0mm width\, 5 / 1.5 m length on SD bobbin\, 10 bobbins per VacuPak Can) is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick No Clean uses pure\, oxygen-free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick No Clean SD is available on ESD safe bobbins for protection against damage due to static electricity. All wick is sealed in nitrogen-purged packaged to avoid corrosion and loss of performance from moisture and oxygen. - Soder-Wick No Clean packaged in ESD-safe static dissipative bobbins - Minimizes the risk of damage associated with static electricity - Patented noncorrosive\, halide free\, organic no-clean flux - Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner - Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for Surface Insulation Resistance - Soder-Wick No Clean SD safely removes solder in all applications requiring Type ROL0 flux - BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes - MIL-F-14256 F - NASA-STD-8739.3 Soldered Electrical Connections - DOD-STD-883E\, Method 2022 - ANSI/IPC J STD-004\, Type ROL0 - Meets MIL-STD-883B\, Bellcore TR-NWT-000078\, ANSI/IPC J SF-818 - Meets parameters tested by the Singapore Institute of Standards and Industrial Research (SISIR) for Solderabilit