Soder-Wick Rosin

Soder-Wick (5' (15.2 m)/bobbin) offers the state of the art in desoldering technology. Soder-Wick is designed for todays heat sensitive electronic components using lighter mass\, pure copper braid construction that allows for better thermal conductivity\, even at low temperatures. Soder-Wick responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage. All wick is sealed in nitrogen-purged packaged to avoid corrosion and loss of performance from moisture and oxygen. - Soder-Wick Rosin 5' and 10' spools packaged in ESD-safe static dissipative bobbins - Minimizes the risk of damage associated with static electricity - Noncorrosive ultra high purity Type R rosin flux - Minimizes the risk of heat damage to the board - Will not leave ionic contamination on the boards - Soder-Wick Rosin safely removes solder in all applications requiring Type ROL0 rosin flux - BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes - SPECIFICATIONS: - MIL-F-14256 F type R flux - NASA-STD-8739.3 Soldered Electrical Connections - DOD-STD-883E\, Method 2022 - ANSI/IPC J STD-004\, Type ROL0